Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A Category_Server Accessories HP B5L37A Page yield: 54000

HP B5L37A Page yield: 54000 pages

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Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A Category_Server Accessories HP B5L37A Page yield: 54000Thermaltake TG 30 Thermal Heat Sink Compound Paste CL O023 GROSGM A TG 30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively. High Thermal Conductivity The thermal compound contains diamond powder, which would provide a thermal conductivity of 4. 5 W m k that could fulfill the users primary needs. Easy to Apply Thermaltakes specially formulated thermal compound fits perfectly with the